Valens Semiconductor to Showcase Latest Connectivity Solutions for Vehicle Safety at CES 2023
Valens Semiconductor, a premier provider of high-speed connectivity solutions for the automotive and audio-video markets, has announced that it will be showcasing the benefits of its automotive high-speed connectivity product suite alongside a comprehensive set of demonstrations from companies in the expanding ecosystem for the MIPI A-PHY compliant VA7000 chipset family at CES 2023. This group will include Tier-1s, camera sensor companies, radar and LiDAR suppliers, component manufacturers, and testing equipment companies, that are serving the growing demand for increased safety in today's and tomorrow's cars.
Valens Semiconductor will also demo its unique solution for enhanced safety and cost-effective rear-view visibility for the trucking industry at CES 2023. This solution, also intended for the aftermarket, provides video connectivity between the tractor and trailer, for high-speed data links, in a very rough and noisy environment.
"The VA7000 delivers a unique combination of unprecedented bandwidth, enhanced electromagnetic compatibility (EMC), and error-free links with practically zero latency, all of which is critical for effective high-speed connectivity in automotive safety and time-sensitive applications, compared to other available solutions," said Gideon Kedem, Senior Vice President and Head of Automotive at Valens Semiconductor. "We are able to do this with a variety of sensor types, be they camera sensors, LiDAR, or radars. As our solution offers low total system cost, we believe interest in our industry-leading solution among automotive OEMs, Tier-1s and Tier-2s will continue to grow and drive further adoption across the ecosystem. CES 2023 is a great platform to demonstrate this continuing success alongside a broad range of leading industry players."
"The Valens Semiconductor chipset with A-PHY compliance will help accelerate the transition to software-defined vehicles, supported by intelligently connected architectures such as Aptiv's Smart Vehicle Architecture™. These architectures, and the software they support, are the foundation for delivering on our mission of enabling a safer, greener, more connected future of mobility," said Glen De Vos, Senior Vice President and Chief Technology Officer of Aptiv. "Aptiv is excited to collaborate with Valens Semiconductor on its innovative connectivity technologies."
The Automotive industry is undergoing a major transformation to sensor fusion, which leverages a combination of different sensor types – cameras, LiDARs, and radars to deliver data and functionality required by safety applications such as ADAS.
"Valens Semiconductor helps Sunny Optical meet the stringent requirements of the automotive industry, by connecting with our state-of-the-art camera modules," said Bob Zhang, General Manager at Sunny Smartlead, Sunny Optical. "We have a significant presence in ADAS and see CES 2023 as a good platform to demonstrate together with Valens Semiconductor the power of our leading solutions."
"We are confident that a growing number of automakers will deploy LiDARs as one of the sensor types that enable/s ADAS in their vehicles for Level 2 autonomy and above. Our LiDAR solution will benefit from standardized solutions that can seamlessly and effectively manage the high bandwidth they extend to cars, to ensure that 3D data for safety applications, will be effectively transmitted and analyzed in future generations of automated vehicles," said Omer Keilaf, Co-Founder and CEO of Innoviz. "We are excited to partner with Valens Semiconductor which will play a vital role with its VA7000 chipset family, which supports all sensor types in enabling the next stages of ADAS."
Due to harness density and length, today's car architecture has been pushed to its limits of space, weight, and complexity. The ability to use unshielded cables and simple connectors in a plug-and-play format using the VA7000 delivers reduced total system cost and an efficient solution for car makers.
"Sumitomo Electric plays a key role in automotive interconnectivity. We are happy to collaborate on the Valens Semiconductor VA7000 video connectivity chipsets to help automotive OEMs and Tier 1s stay ahead of the curve," said Hiroki Hirai, General Manager of CAS-EV Development Promotion Division, at Sumitomo Electric. "At CES 2023, Valens Semiconductor will demonstrate how their chipsets integrate with our world-class harnesses."
As car companies integrate sensors requiring higher bandwidth and EMC into next-generation ADAS and autonomous systems, interoperability among multiple vendors' components will be crucial. To address this need, test equipment vendors are beginning to create off-the-shelf testing solutions.
"At Keysight, we recognize that it is critical to address the growing market demands for high-speed digital interfaces for next-generation in-vehicle connectivity," said Thomas Goetzl, vice president and general manager for Keysight's Automotive and Energy solutions business unit. "The compliance test solution from Keysight represents yet another way we are supporting the evolution and standardization of technologies for our automotive customers."
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