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Submissions are now being welcomed for the highly anticipated 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI). The event, eagerly awaited by professionals in the field, is scheduled to unfold against the vibrant backdrop of Phoenix, Arizona—a city immersed in a dynamic technological landscape.

Emerging Topics Proposed by the Technical Program Committee:

• EMI/EMC Issues for Transportation Electrification
• Semiconductor and Chip EMC
• Packaging
• Autonomous Vehicles
• Charging and Wireless Charging
• Intentional EMI and Cybersecurity

This event promises a platform to share insights, ask questions, learn from experts and innovators, and discover new products shaping the future of electromagnetic compatibility.

Key Dates to Remember:

• December 13, 2023: Deadline for Special Session Proposals
• January 8, 2024: Traditional and Special Session Paper Submission Deadline
• February 19, 2024: Notification of Acceptance/Rejection for Traditional and Special Session Papers
• March 4, 2024: Deadline for Abstract-Reviewed Papers, Workshops & Tutorial, Experiments & Demonstrations Proposals
• March 18, 2024: Revised Traditional and Special Session Paper Submission Deadline
• April 12, 2024: Notification of Acceptance/Rejection for Workshops & Tutorials, Experiments & Demonstrations
• April 19, 2024: Notification of Acceptance/Rejection for Traditional, Abstract-Reviewed, and Special Session Papers
• May 15, 2024: Final Paper, Workshop & Tutorial Submission Deadline

Click here to learn more about paper submission details.