EMC, Weight Reduction, and Multi-Gigabit Call for Optical Harness

 KDPOF
EMC, Weight Reduction, and Multi-Gigabit Call for Optical Harness

Complexity stays low with simple modulation.
For fiber, the OM3 class is chosen since it is
already extensively used by data centers and
avionics. Only extensively used light sources
will be selected. Two connector grades are
defined in order to allow cost-effective
implementations. Regarding topology,
asymmetric up and down links have been
considered from the beginning. The use of the
Energy-Efficient-Ethernet (EEE) specification is
an appropriate candidate to implement this
feature. Cameras, displays, and further
asymmetrical use cases have been included as
test cases for standardization. An OAM side-
channel will be available for dependability and
link management. The absence of
retransmissions means controlled latency for
video distribution. Symmetric links will be
added for backbone communications.

With cost-down and consistency in focus,
optics, fibers, connectors, and electronics
already developed for nGBASE-SR will be
reused. Further specifications include 850 nm
VCSEL, multimode OM3 fiber, PAM2 receivers,
and connectors. Standardization work focuses
on the automotive requirements: VCSEL
reliability for the operation temperature
range, connector development with quality
grades, and an adaptive DSP to cope with the
large parametric deviation of the VCSEL.
Increasing the yield percentage results in cost
reduction.

The key advantages of the optical solution for
specific applications using multi-gigabit speeds
with in-vehicle connectivity are, among
others, Electromagnetic Compatibility (EMC)
thanks to the inherent galvanic isolation, low
weight, and low cost. Relevant use cases from
different carmakers in Europe and the USA
incorporate the comprehensive features and
benefits of optical network technology. Key
leading optoelectronic, connector, and wire
harness vendors worldwide are prepared and
already provide a well-supplied and
competitive market with all the new
components needed for multi-gigabit in the
car: Physical Layer (PHY), Fiber Optic
Transceiver (FOT), fibers, connectors, and light
sources. The technology will be scalable in
order to enable even higher data rates in the
future. By combining optimization in all areas
of the new standard, the right balance of
complexity and cost among all parts (CMOS IC,
VCSEL, PD, ferrules, sleeves, cable, in-line
connection technology, optics, and lenses,
etc.) can be achieved in order to deliver the
lowest cost, most reliable, and highly scalable
solution to the automotive market.

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