ETS-Lindgren Announced its Technical Contribution to IEEE CPMT Symposium Japan 2022
ETS-Lindgren announced its technical contribution to the 11th IEEE Components, Packaging, and Manufacturing Technology (CPMT) Symposium sponsored by the IEEE Electronics Packaging Society (EPS). The hybrid event of on-site and virtual meetings will be held from November 9 to 11 in the Kyoto University Clock Tower Centennial Hall in Kyoto, Japan, as the on-site venue. IEEE EPS is the leading international forum for scientists and engineers engaged in the research, design, and development of revolutionary advances in microsystems packaging and manufacturing. Regarding the ICSJ2022 technical program, IEEE EPS Special Speakers include Sam Karikalan with Broadcom Inc., on the topic "Material Needs for Meeting Next Generation Advanced Packaging Challenges" and Chris Bailey with University of Greenwich on the topic "Materials and Modelling Challenges for High Reliability Packaging.” IEEE EPS President Kitty Pearsall with Boss Precision Inc., will provide the formal Symposium Welcome.
Invited speakers include industry experts on varied topics such as Photonics, Process and Material Technologies, Signal/Power/RF/EMC, Bioelectronics and Healthcare, Power Electronics, and Automotive. Garth D’Abreu, Director of Automotive Solutions with ETS-Lindgren, is the invited speaker for the Automotive presentation “Trends in Reverb Chamber Testing,” scheduled for Thursday, November 10, in Session 7 from 13:40 to 14:05 JST in Hall I & II, with a remote discussion via interactive voice.
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