Ansys has introduced updated identities and expanded capabilities for its electromagnetic solvers in 2023. These solvers play a critical role in addressing electromagnetic interference (EMI) challenges during the design process of electronic devices, ranging from cell phones and laptops to vehicles and satellites.
The Ansys EMA3D Cable is now recognized as Ansys EMC Plus, while Ansys EMA3D Charge is now referred to as Ansys Charge Plus. These updated names not only reflect the evolution of the solvers but also signify the additional capabilities they now possess.
Ansys EMC Plus:
The Ansys EMC Plus enables original equipment manufacturers (OEMs) and automotive suppliers to assess and ensure the electromagnetic compatibility of in-vehicle electronics. By incorporating EMC Plus into the development workflow, OEMs and Tier One suppliers can evaluate EMC early on, enabling design modifications that reduce risks and costs during vehicle testing and production.
The enhanced capabilities of EMC Plus expand beyond its previous scope, focusing on platform-level electromagnetic simulation for all relevant parts, not just cables. This comprehensive tool offers a complete vehicle-level electromagnetic modeling solution, capable of simulating cables, bundled cables, and large-scale objects such as equipment enclosures or vehicle frames to determine their electromagnetic profiles.
Moreover, EMC Plus facilitates the modeling and simulation of various electromagnetic phenomena and interactions between electrically charged objects within electromagnetic fields. For example, it can assess electromagnetic emissions from a cable connected to a smartphone plugged into an automotive console, which may adversely affect the signal trace on the smartphone's printed circuit board.
Ansys EMC Plus encompasses a range of capabilities and solvers designed to enable the design of products with electromagnetic interference considerations and mitigate potential hazards. It assists design teams in ensuring compliance with government regulations and standards for consumer electronics, automotive systems, and aerospace electronics products.
The table below provides a snapshot of EMC Plus capabilities for consumer, automotive, and A&D electronics applications based on common customer use cases.
Customer Need | Ansys EMC Plus Solution |
Electromagnetic environmental effects (E3): Customers must predict the impact of the electromagnetic environment on the operational capability of defense forces, systems, equipment, and platforms — such as lightning and high-intensity radiated fields coupling to aerospace vehicles at the electronics interfaces. | Ansys EMC Plus allows for efficient simulation of full aircraft and spacecraft. The tool has been validated against full aircraft testing and can include the mechanical computer-aided design (CAD) model of the platform and all the necessary cable harness segments. |
Full-vehicle electromagnetic compatibility (EMC) with cables: Vehicle manufacturers must predict effects at the vehicle level, including all the complexity of the entire platform involving hundreds of cable harness segments. | Ansys EMC Plus allows users to quickly create full-vehicle models. The product automates import of cables and represents them in a way that hundreds can be included in a single model. |
Full-device electromagnetic compatibility (EMC): Electronic devices must consider the effects of printed circuit boards (PCBs), enclosures, and cables to predict full device compatibility. | Ansys EMC Plus has a new PCB import tool to allow for board files to be imported with component and material assignments made automatically. The board may be easily fused with the enclosure in a mechanical CAD model and cable details for a full device model. |
Radio frequency (RF) de-sense: Electronic device and vehicle manufacturers must understand unintentional coupling or cross-signaling from PCBs and cables that may impact nearby RF system performance. | Ansys EMC Plus has an easy-to-use workflow to merge the electronic CAD specification of the PCB, mechanical CAD specification of the enclosure, and cables with models of the device antennas. The result is a comprehensive full-device model in the shortest amount of time. |
Ansys Charge Plus
Charge Plus leverages four solvers designed to analyze charging and discharging phenomena across a range of applications — including internal and surface charging, particle transport, and arcing across interfaces — in a single workflow. When used by itself and in tandem with other Ansys products, the software offers a variety of physics to address large-scale electrical problems very easily, in many cases helping users learn and work through those problems themselves in A&D environments.
Charge Plus also leverages its solvers to model, then simulate charged plasma — a high-energy gas with its own unique properties — or a group of charged particles that can also be treated as plasma with its own energy and charge. Plasma can arise in various circumstances — such as when radiation bombards a spacecraft orbiting Earth, creating a charge on a satellite solar panel surface.
Ansys Charge Plus Solution Highlights
Customer Need | Ansys Charge Plus Solution |
Space environment and radiation effects: Spacecraft manufacturers and their suppliers need to understand the impact of space environments and radiation on spacecraft materials and components. | Ansys Charge Plus includes multiple solvers to predict spacecraft surface charging, internal charging, and radiation effects. It can handle 3D geometry and set up simulations in an easy-to-use interface. |
Electrostatic Discharge (ESD): Electronics designers need to model the effects of non-contact, air ESD (static electricity) on their products. | Ansys Charge Plus has an air ionization module that allows for the nonlinear effects of ESDs and discharges to be modeled from first principles. It enables the import of complex electronic CAD and mechanical CAD files to address all parts of an electronic device easily. |
Arc extinction: Designers of switches and circuit breakers must design products so that negative effects of the arcs, caused when a gas electrically breaks down resulting in prolonged electrical discharge, are minimized at the lowest cost. | Ansys Charge Plus has co-simulation functionality with Ansys Fluent using Ansys System Coupling to allow for direct coupling for a true multiphysics solution. |
Semiconductor plasma modeling: Semiconductor chip manufacturers use plasma processes to aid in chemical vapor deposition (CVD, i.e. coating) or etching. They require the ability to model the physical processes in the plasma and on the surface of chips. | Ansys Charge Plus has compressible fluid dynamics coupled to the existing electrodynamic and particle-in-cell (PIC) solvers in Charge Plus to create an advanced simulation tool for plasma and gas flow modeling in applications such as plasma-enhanced CVD and etching. Ionized gas and surface reactions are now captured in Charge Plus by coupling Chemkin-Pro to the PIC and the CFD solvers, providing a streamlined approach to simulating the complex chemical reactions involved in plasma-assisted processes. |
Click here to learn more about Ansys EMC Plus.
Click here to learn more about Ansys Charge Plus.