EMC + SIPI 2023 Invites Participants for Exhibition and Symposium
The 2023 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) will bring together the world’s top researchers and industry-leading companies to share ideas and advances in our field. The 5-day event will be held from July 31st to August 4, 2023 at Devos Place Convention Center, Grand Rapids, Michigan, USA.
EMC+SIPI 2023 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. Many of the most important developments in Electromagnetic Compatibility & Signal/Power Integrity have historically been first presented at EMC+SIPI, and 2023 will be no exception. The Symposium offers a unique opportunity to meet new prospects and develop deep relationships with influencers and decision makers who will make decisions on products and services offered by the exhibitors and sponsors.
THE IEEE EMC Society is seeking original, unpublished papers covering all aspects of EMC and technologies that are affected by EMC. IEEE EMC+SIPI 2023 invites participants to share insights, ask questions, learn from the experts/innovators and see new products. Published paper will be seen by thousands in the EMC community and across the wide array of disciplines that look to the IEEE EMC Society for technical guidance. In addition, it will be uploaded to IEEE Xplore with the exposure and recognition that brings.
The topics covered are:
- EMC Measurement and Environment
- EMC Management and Standards
- High Power Electromagnetics
- Lightning
- System-Level EMC and Protection
- Low Frequency EMC (Renewable Energy and Smart Power Grid EMC)
- EMC in Space
- Electric Vehicle, Automotive, Railway and Ship EMC
- Signal Integrity and Power Integrity
- IC and Semiconductor EMC
- Computational Electromagnetics
- Wireless Communication EMC
- EMC Nanotechnology
- Biomedical EMC
- Antenna & Propagation
- TSV for 3D-IC and 3D System Integration
Click here to learn more about the details of call for submissions.
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